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General Info

Experiencing twenty-seven years of strong commitment and immense growth, the IEEE MEMS conference series has evolved into a premier annual event in the MEMS area. The 29th IEEE International Conference on Micro Electro Mechanical Systems (MEMS 2016) will report latest research results on every aspect of Microsystems technology, reflecting the continuing commitment and success of the international MEMS community. In recent years, the IEEE MEMS Conference has attracted more than 700 participants along with over 800 abstract submissions, and has created the forum to present over 200 selected top-quality papers in podium and poster/oral sessions. Its technical sessions provide ample opportunity for interaction between attendees, presenters and exhibitors. MEMS 2016 will be held in Shanghai, China, from January 24 - 28, 2016. The major areas of activity in MEMS research solicited and expected at this conference include but are not limited to:

  • Design, simulation and analysis tools with experimental verification
  • Fabrication technologies and processes
  • Silicon and non-silicon materials
  • Electro-mechanical integration techniques
  • Assembly and packaging approaches
  • Metrology and operational evaluation techniques
  • System architecture

The major areas of activity in the application of MEMS solicited and expected at this conference include but are not limited to:

  • Mechanical, thermal, and magnetic sensors, actuators, and systems
  • Fluidic microcomponents and microsystems
  • Microdevices for biomedical engineering
  • Micro chemical analysis systems
  • Microdevices for inertial sensing
  • Microdevices for wireless communication
  • Microdevices for power supply and energy harvesting
  • Optomechanical microdevices and microsystems
  • Nano-electro-mechanical devices and systems
  • Scientific microinstruments